# Magnetron L750

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Magnetron sputtering system (MSS) for rectangular targets with a nominal length of 787 mm, target 749?100?6 mm.

Purpose: effective sputtering of conductive targets by ion bombardment in plasma of anomalous glow discharge.

In DC mode, deposition of metals and alloys (including resistive) with preservation of stoichiometric composition is possible. With pulsed medium-frequency power, sputtering of semiconductors and dielectrics in reactive mode from metal targets is possible.

## Technical specifications

- Target shape: rectangular
- Maximal target thickness: 15 mm with target holder; 20 mm with direct water cooling
- Target length: 749 mm
- Target width: 100 mm
- Operating voltage, V: 800 V
- Maximal current, A: 15 A
- Maximum power, W: 20000 W
- Operating pressure range, Pa: 0.05–10 Pa