# Magnetron D100

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Magnetron sputtering system (MSS) for round targets with a diameter of 95–100 mm.

Purpose: effective sputtering of conductive targets by ion bombardment in plasma of anomalous glow discharge.

In DC mode, deposition of metals and alloys (including resistive) with preservation of stoichiometric composition is possible. With pulsed medium-frequency power, sputtering of semiconductors and dielectrics in reactive mode from metal targets is possible.

Minimum coolant consumption at a working power of 1 kW is 1 l/min.

Coolant (recommended): distilled water, 20% solution of ethyl alcohol in distilled water according to GOST 6709-72.

This magnetron is available in special versions.

## Technical specifications

- Target diameter: 95–100 mm
- Maximal target thickness: up to 10 mm
- Operating voltage, V: 300–800 V
- Maximum power, W: 3500 W
- Working gas: Ar, O2, N2 and their mixtures
- Operating pressure range, Pa: 0.07–10 Pa