# Resistive layers deposition

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Resistive layers deposition systems are used to make films by magnetron sputter deposition or PVD under surface resistance monitoring. These layers are used in thin film technology in hybrid integrated circuits production, precise and high power resistors, temperature and strain sensors.

Resistive functional layers obtained by vacuum coating methods can be:

- thin metal films (tantalum, platinum, chrome, nichrome) are used for the manufacture of temperature and strain sensors, high-power precision resistors

- special resistive alloys with high stability and low temperature coefficient in a wide temperature range
- single- and multicomponent nitrides, allowing to obtain stable resistors that retain their parameters at high operating temperature, with controlled temperature coefficient
- oxides used to produce transparent conductive coatings

The most convenient and universal method of applying resistive layers is magnetron sputtering, which allows you to get all the above types of films in one system with a quick change of technology possible. Magnetron sputtering also allows performing technological processes that cannot be implemented by other methods, such as joint sputtering of two different materials at the same time. For compatibility with old technological requirements developed before the widespread use of the magnetron sputtering method, it is possible to deposit resistive layers by PVD technology thermal evaporation in vacuum, including flash evaporation with feeding of the source material powder from a vibrofeeder.